RK3566 Mainboard PCBA Assembly Process Explained: From SMT to Final Testing

The RK3566 processor by Rockchip is a powerful, cost-effective quad-core ARM Cortex-A55 chip widely used in smart home control panels, industrial tablets, AIoT devices, and embedded systems. To bring an RK3566-based mainboard to life, precise and efficient PCBA (Printed Circuit Board Assembly) is essential. This article explores the end-to-end PCBA assembly process for RK3566 and RK3568 mainboards, highlighting key technical steps, best practices, and how OEM/ODM businesses can optimize for cost, quality, and performance.

1. Understanding the RK3566 and RK3568 Mainboards

RK3566 and RK3568 are system-on-chips (SoCs) designed for embedded computing. While RK3566 supports moderate multimedia and computing tasks, RK3568 offers additional interfaces, higher performance, and enhanced I/O support—making them both ideal for custom mainboards used in smart control panels and industrial solutions.

Key Features:

  • Quad-core Cortex-A55 CPU
  • Integrated GPU (Mali-G52)
  • Support for eMMC, SPI NOR/NAND, and SDIO
  • LVDS/MIPI/HDMI video output
  • Rich peripheral support (USB, Ethernet, PCIe, CAN, etc.)

2. PCBA Assembly Workflow for RK3566/RK3568 Mainboards

Step 1: PCB Design & DFM Review

Before assembly, a Design for Manufacturability (DFM) check ensures the PCB layout is optimized for SMT. Key areas include:

  • BGA pad design for RK3566 SoC
  • Power trace routing for PMIC
  • High-speed signal integrity for DDR and HDMI

Step 2: SMT (Surface Mount Technology) Assembly

  • RK3566 SoC and memory chips (LPDDR4, eMMC) are usually packaged in BGA (Ball Grid Array), requiring precise SMT reflow.
  • A high-quality stencil and accurate pick-and-place machine are critical to avoid solder bridges or cold joints.

Step 3: AOI and X-Ray Inspection

  • AOI (Automated Optical Inspection) checks component alignment, solder quality, and orientation.
  • X-ray inspection is mandatory for BGA packages like the RK3566 chip, verifying hidden solder ball quality.

Step 4: Through-Hole & Manual Soldering

  • For components like DC jacks, CAN connectors, or Ethernet transformers, manual soldering or wave soldering is used.

Step 5: Firmware Burning & Functional Testing

  • The bootloader and Linux/Android OS are flashed into eMMC or SPI NOR.
  • A full functional test (FCT) is conducted, checking USB ports, HDMI output, network connectivity, and GPIOs.

Step 6: Aging & Reliability Testing (Optional)

  • Some industrial-grade solutions require burn-in tests at high temperatures or voltage cycling to ensure long-term stability.

3. Tips for High-Yield RK3566/RK3568 PCBA Production

  • Use High-Precision Reflow Ovens to maintain temperature curves for BGA soldering.
  • Choose IPC Class 2 or 3 PCB Standards for better durability.
  • Optimize BOM for Availability: Use mainstream components to reduce lead times.
  • Validate DDR Routing Layouts carefully to ensure boot stability.

4. Why Choose Portworld for RK3566/RK3568 PCBA Solutions

At Portworld, we specialize in custom embedded mainboard assembly using Rockchip SoCs like RK3566 and RK3568. Our advantages include:

  • Full PCBA Service: From schematic design to mass production.
  • BSP and Software Support: We offer Linux/Android SDK integration and tuning.
  • PoE, RS485, CAN Bus Ready Designs for smart control panel applications.
  • SMT and X-Ray In-house Capability: Ensuring precision for BGA components.
  • CKD/SKD Options Available: Lower tariff burden and better logistics control.

Whether you’re building a 4-inch or 5-inch smart home control panel or an industrial touch terminal, Portworld can help accelerate your time-to-market with a reliable and scalable PCBA solution.

RK3566 and RK3568-based mainboards are at the core of many modern embedded systems. Ensuring high-quality PCBA assembly—from design and SMT to final testing—is critical for performance, reliability, and long-term success. Choosing an experienced partner like Portworld helps you unlock the full potential of Rockchip solutions, reduce costs, and ensure seamless integration into your smart device ecosystem.